Established in 2002 at Zhangjiang Hi-tech Park of Pudong, Shanghai, Comlent is the 1st RFIC design house in China focusing on handset RFIC and mixed-signal SoC chipset solutions. Products of Comlent nowadays include RF transceivers in CMOS technology for mobile phones and portable digital mobile devices, etc.
Investors of Comlent include Intel Capital and leaders in semiconductor industry worldwide.
The core team members of Comlent are semiconductor professionals with years of RFIC R&D experience and management experience. The company has over 70 employees, 70% of which have master or Ph.D. degrees, 80% are engineers, and 57% are IC designers, 18% of which have oversea employment experience......

 
   
RF Transceiver and Analog Base Band chipset for TD-SCDMA Handset: CL4020+CL4520
RF chipset for PHS handset: CL3110+CL3503
RF single chip for PHS handset: CL3213
FM Radio single chip for handset and portable devices: CL6010
06-11 Domestic chip bottleneck breakthrough paves the way for China's 3G launch
06-04 Successful completion of phone call using Comlent TD-SCDMA transceiver
06-03 Comlent and Agilent establish 3G TD-SCDMA lab in China
05-05 Comlent Commences Pilot Production Of China's First Complete RFIC Transceiver For Cellular Handset
04-12 Chinese company develops complete RFIC transceiver
04-12 Comlent was granted the "China IC industry's 1st Decade Anniversary Start-up" Award by CSIA
04-11 Drafting an Industry From the Ground Up
04-04 Intel Capital Invests in Comlent
04-03 Shanghai's Comlent Raises US$7M Second Round From 3i And Intel
04-03 Intel cash tops up Comlent's coffers