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Shanghai's Comlent Raises US$7M Second Round From 3i And Intel
2004-03-30

<Pacific Epoch>

3i, Comlent, Intel
Posted by: Paul Waide on Mar 30
Editorial Summary

Shanghai based chip designer Comlent Holdings has closed a US$7 million second round with investments from Intel and 3i among others. Comlent focuses wireless chip design for Little Smart (PHS) and WiFi handsets. This latest round brings the company's total raised over the last two years to over US$9 million - most of which has gone to R&D. Comlent's low cost development model was said to have appealed to investors. Comlent's designs integrate the functions of six chips onto one or two chips, reducing the cost of a Little Smart handset from 30 dollars to 25 dollars and WiFi handsets to 22 dollars.

 
 
 
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